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Built to scale

Photon Bridge is designed for manufacturing from day one. Leveraging OSAT-aligned integration and relaxed tolerances, we target lower cost at volume, higher yield, and faster paths from prototype to production.

How we manufacture

Our OSAT compatible pick and place process fuses only burn-in tested III-V dies with low loss silicon waveguides, achieving <1dB coupling loss and high yields, delivering unmatched density, reliability and scalability for AI datacenters and telecom.

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Fully parallel wafer processing

—  Tier 1 Foundries

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Fully tested

—  Known Good Dies (KGD)

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OSAT

—  Flip chip assembly
—  Fully tested chips

Flip chip assembly

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