Built to scale
Photon Bridge is designed for manufacturing from day one. Leveraging OSAT-aligned integration and relaxed tolerances, we target lower cost at volume, higher yield, and faster paths from prototype to production.
How we manufacture
Our OSAT compatible pick and place process fuses only burn-in tested III-V dies with low loss silicon waveguides, achieving <1dB coupling loss and high yields, delivering unmatched density, reliability and scalability for AI datacenters and telecom.
Fully parallel wafer processing
— Tier 1 Foundries
Fully tested
— Known Good Dies (KGD)
OSAT
— Flip chip assembly
— Fully tested chips
Flip chip assembly
Proven scalability
Photon Bridge is building a true product company, spanning from the photonic chip to the fully integrated module,
We deliver a packaged, deployment-ready external laser sources, and we collaborate with world-class partners to support a reliable path to scale and to accelerate volume production for CPOs and high-density interconnect applications. This confirms that our platform is built for real-world manufacturing.
Today, Photon Bridge demonstrates proven manufacturability and volume scalability.
